VECO
Veeco Instruments
Investor Presentation
March 2025
Contents
Overview
Veeco at a Glance
Who is Veeco?
Role in the Semi Manufacturing
Strategy & SAM Opportunities
Available Market
SAM Opportunities
Why Own Veeco?
Financials
Revenue by End-Market
Historical Financials
Customers, Resource Alignment, Veeco Team & ESG
Backup & Financial Tables
3
Financial
strength and
flexibility
at a glance
Global provider of
semiconductor
capital equipment
Solving
Differentiated
customers high
technologies with
value materials
opportunities to
challenges
expand SAM
$
$717M
2024 Revenue
~1200
Employees
~350
Patents
4
Who is ?
StrongHistory
Semiconductor
Solving materials challenges
Data Storage
Compound Semiconductor
2019- Today
2010 - Today
Differentiated Laser
1990's - Today
MOCVD Technology Fabricated
Annealing & Ion Beam
GrowthFocus
Ion Beam Technologies for
70%+ of LED's globally
Deposition technologies
Semiconductor & Compound Semiconductor
enabling most advanced
manufacturing of 100% of
chips on the planet
HDD heads
Well Positioned
Leading edge customers drive growth
5
's Role in Semi Manufacturing
Representative Process Steps
FRONT END
BACK END
Deposition Lithography
Etch
Ion
Annealing
Inspection/
Advanced
Implantation
Metrology
Packaging
IBD
IBD
LSA
NSA
Wet
Litho
300
EUV
Processing
Veeco technologies are critical for several Semi manufacturing process steps
IBD - Ion Beam Deposition
LSA- Laser Spike Annealing
6
EUV - Extreme ultraviolet
NSA - Nanosecond Annealing
Driving business today
New products
Strategy & SAM Opportunities
Available Market
Total Veeco SAM
Veeco's Served Available Market projected to grow to ~$4.4B
Semiconductor opportunity projected to grow to ~$2.7B driven by Laser Annealing, Ion Beam Deposition, and Advanced Packaging equipment
Compound Semiconductor opportunity projected to grow to ~$1.2B driven by equipment for GaN Power and Photonics
ProjectedCAGR~15%
~$2.5B
~$4.4B
8
20252029
Semiconductor
Compound Semiconductor
Data Storage
Scientific & Other
SAM - Served Available Market
GaN - Gallium Nitride
* Veeco Served Available Market based on TrendFocus, Gartner, Yole Group and internal analysis
Semi SAM Expansion To Drive Outperformance
Markets
Industry
Enabling Technologies
Inflections
Advanced
GAA/BSPD
Logic
Device Shrink -
NSA
IBD
NA Lithography
Memory
300
HBM/3D
Advanced
3D Packaging
Wet
Packaging
Heterogeneous
Processing
Integration
20%
15%
10%
5%
0%
2025-2029 CAGR *
WFE Growth Veeco Semi SAM
Enabling technologies for industry inflections provide opportunity to outperform WFE growth
*WFE CAGR based on Tech Insights Long-Term Semiconductor, Silicon, and Equipment forecast, Veeco Semi SAM CAGR based on TrendFocus, Gartner, Yole Group and internal analysis.
BSPD - Backside Power Delivery
Semiconductor SAM Projected Growth
Key Growth
Drivers
2025
2029
LaserSpike
•
PTOR at 3 Tier 1 logic and 1 HBM DRAM customer
Annealing
•
Reached agreement to ship LSA system to 2nd HBM
~$600M
~$850M
(LSA)
customer in 2025
Nanosecond
•
2 evaluation systems at Tier 1 logic customers
NEW Annealing
•
Strong pull from 3rd Tier 1 logic customer for
~$100M
~$450M
(NSA)
evaluation tool
IBD
EUV Mask
•
PTOR for EUV mask blank deposition
~$70M
~$120M
Blanks
IBD300
• 2 evaluation systems at HBM customers
NEW FrontEnd
~$50M ~$350M
•
Strong pull from Tier 1 logic customers for evaluations
Semi
Advanced
• Wet processing system PTOR for 3D Packaging for AI
•
AP Litho system PTOR at Foundry and OSATs
~$350M
~$650M
Packaging
Total SAM
~$2.7B
Addvvaanncceed
Projected~18% CAGR
Paacckkaaggiinngii
IIIoon Beeaam
~$1.3B
Deeppoossiitiitittioonii
Advanced
Packaging
Ion Beam
Laasseerrr
Deposition
Annnneeaallillinngii
Laser
Annealing
2025
2029
LSA
NSA
IBD EUV
IBD300
Advanced Packaging
Service & Other
Severalsubstantialgrowthopportunities in Semiconductor market
EUV - Extreme Ultraviolet
10
IBD - Ion Beam Deposition
PTOR - Production Tool of Record
Source: Veeco Served Available Market based on TrendFocus, Gartner, Yole Group and internal analysis
Disclaimer
Veeco Instruments Inc. published this content on March 03, 2025, and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on March 03, 2025 at 15:05:29.796.