Amkor Technology : Investor Presentation – February 2025

AMKR

Enabling the Future

Amkor Technology Investor Presentation

February 2025

© 2025 Amkor Technology, Inc.

Amkor's Strong Track Record

Trusted Partner

Founded in

1968

Engaged with Industry

Leaders

8

Broad Geographic Footprint

Countries

13M

sq ft

(1.2M sqm)

Manufacturing Space

Building the Future

$744M

2024 CapEx

Best in Class

R&D

Drives Innovation

~30,000

Employees

Leadership Position

Leading

Automotive OSAT

$6.3B

Revenue in 2024

82%

2024 Advanced Packaging

% of Revenue

© 2025 Amkor Technology, Inc. 3

Packaging and Test Integral to Semiconductor Supply Chain

Early design engagement with OEMs and semiconductor companies enhances packaging innovation

Original Equipment

Semiconductor

Wafer

Packaging

Final Product

Manufacturers

Companies

Manufacturing

and Test

Assembly

Smartphone & Tablet

Fabless

Wafer Foundry

OSAT

EMS

Hyperscalers, PC

IDM

IDM Fab

IDM Factory

Automotive

Consumer Electronics

© 2025 Amkor Technology, Inc. 5

Amkor's Turnkey Service Offering

Reduce Cycle Time, Increase Value

Design

Materials

Wafer Bump,

Package

Final Test

Drop

Innovation

Management

Probe, Dicing

Assembly

SLT

Ship

Leadframe, Power

MEMS & Sensors

Memory

Flip Chip, PoP MCM

2.5D, 3D

SiP, Heterogeneous

WLFO

Integration

© 2025 Amkor Technology, Inc. 6

Strategic Focus Areas Leverage Our Key Differentiators

Technology

Geographic Footprint

Leverage Advanced Packaging Leadership

Support Global & Enable Local Supply Chains

Tier 1 OSAT with complete Advanced

Broadest OSAT

packaging and test portfolio

geographic footprint

Trusted innovation partner

Expanding in U.S., Korea, and

for industry leaders

Portugal

Proven operational excellence

Well positioned to enable

track record

regional supply chains

Markets

Focus on Industry Megatrends

5G communications

HPC and AI

Automotive electronics

IoT devices

© 2025 Amkor Technology, Inc. 7

Amkor is an Advanced Packaging Leader

Industry Megatrends

Rely on

Advanced Packaging Innovation

Heterogeneous Integration

Miniaturization

Power Management

Improved Performance

© 2025 Amkor Technology, Inc. 8

Broad Geographic Footprint

13 Million Square Feet (1.2M sqm) of Manufacturing Space

KOREA

4.48M sf (0.42M sqm)

JAPAN

1.77M sf (0.16M sqm)

SHANGHAI

1.40M sf (0.13M sqm)

TAIWAN

1.12M sf (0.10M sqm)

VIETNAM

1.47M sf (0.14M sqm)

PHILIPPINES

1.32M sf (0.12M sqm)

MALAYSIA

0.43M sf (0.04M sqm)

PORTUGAL

0.52M sf (0.05M sqm)

Amkor Headquarters

Assembly & Test Facility

Customer Support Center

© 2025 Amkor Technology, Inc. 9

Diversified End Markets

Leveraged to Industry Megatrends

2024 Results

48% 19% 18% 15%

Automotive &

Communications

Computing

Industrial

Consumer

Smartphones l Tablets

Data Center I Infrastructure

ADAS I Electrification

A/R & Gaming I Connected

PC/Laptops I Storage

Infotainment l Safety

Home I Home Electronics I

Wearables

© 2025 Amkor Technology, Inc. 10

Disclaimer

Amkor Technology Inc. published this content on February 25, 2025, and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on February 25, 2025 at 18:05:05.700.