DuPont Powers AI and Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025

Published: 2025-06-04 02:05:25 ET DD

Published on 06/04/2025 at 02:05

DuPont announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03, DuPont will showcase its extensive portfolio of advanced interconnect solutions, which encompass fine line, signal integrity, power and thermal management. As artificial intelligence (AI) continues to transform industries, the demand for high-performance IC substrates is surging, with Japan at the forefront of providing innovative materials and processes.

These advanced substrates are critical for bridging AI chips and printed circuit boards, enabling quicker data processing and improved thermal management. The global IC substrate market is poised to experience notable growth, driven by the expanding AI ecosystem and the increasing demand for advanced solutions. DuPont's comprehensive solutions empower IC substrate manufacturers to expedite product development and enhance production efficiency.

Key offerings include DuPont?? Circuposit?? desmear and electroless copper for mSAP and SAP processes, and DuPont??

Copper Gleam?? electrolytic copper for conformal through-hole plating, which enhances core layer plating technologies. Moreover, DuPont??

Microfill?? acid copper optimizes blind via filling for build-up layers, thereby boosting mSAP and SAP process efficiency. Additionally, DuPont??

Riston®? dry film photoresist is essential for a variety of applications, including core and build-up layers, final finishes, and copper pillars. Visitors to DuPont's booth are invited to connect with experts and discover integrated solutions designed to drive success in the rapidly evolving electronics industry, including complete range of offerings for PCBs.

Circuposit?? SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced packaging, meeting the demands for low roughness dielectrics and low Dk and Df properties, essential for fine line and high-frequency designs.

Microfill?? SFP-II-M acid copper offers excellent pattern uniformity, ideal for high-performance computing and AI chip applications. Microfill??

GFH-100 acid copper efficiently fills high aspect ratio through-holes for TGV applications with a unique bridging waveform and one-bath plating. Meanwhile, Microfill?? AHF acid copper supports various hole types in HDI and IC substrates, enabling stacked via structures for simpler processing.

Riston®? DI1600 and DI1600M dry film photoresists are advanced solutions that enable fine line direct imaging for IC substrate applications. They provide excellent adhesion and resolution, ensuring high-yield performance.

olderon?? TS7000 series solder is a SnAg micro bump plating solution for HBM applications. It offers excellent coplanarity, ideal for mixed and fine pitch micro-bumps, and supports both soluble and insoluble electrode plating solutions for added versatility.

YCLOTENE?? dry-film photo-imageable dielectric (DF-PID) for fan-out panel level package (FOPLP) provides excellent coplanarity through lamination and achieves desired thickness in a single step, unlike liquid dielectrics that require multiple coatings. Additionally, DF-PID for glass core substrate effectively fills through-glass vias (TGV) without voids in glass core substrates, which have successfully passed multi-reflow, unbiased highly accelerated stress test (bHAST), and high-temperature storage (HTS) reliability tests, showing no delivery or cracking post-assessment.

Pyralux®? ML laminates are a breakthrough in non-copper-based materials, providing OEMs with a reliable, customizable solution for high-copper-based materials.