Amkor Technology : Investor Presentation – May 2025

Published: 2025-05-02 19:08:36 ET AMKR

Published on 05/02/2025 at 19:08, updated on 05/02/2025 at 19:04

Enabling the Future

Amkor Technology Investor

Presentation

May 2025

Global OSAT

Broad geographic footprint in 8 countries

Amkor at a Glance

Years

Largest

of experience packaging and testing

semiconductors

$6.3B 2024 Revenue

Headquartered OSAT

U.S. based manufacturing coming soon1

Global semiconductor companies rely on Amkor

2024 Advanced Packaging

82%

2024 CapEx

$744M

% of Revenue

Advanced Packaging Revenue CAGR2 16%

Investing for our future

Advanced technology supporting HPC, SiP and Test

Note: OSAT is defined as Outsourced Semiconductor Assembly and Test

1 Plans to break ground on US facility in 2025

2 Reflects 2019-24 Advanced Packaging revenue CAGR

Increasing Total Addressable Market

Semiconductor Market

$1,000

$1 Trillion

($ in billions)

Smartphones Data Centers

$500

Laptop Desktop Mobile

Gaming Home Audio

2002 2004 2006 2008 2010 2012 2014 2016 2018 2020 2022 2024 2030E

Source: Gartner, McKinsey

Early design engagement with OEMs and semiconductor companies enhances packaging innovation

Packaging and Test Integral to Semiconductor Supply Chain

Original Equipment

Manufacturers

Semiconductor

Companies

Wafer

Manufacturing

Final Product

Assembly

Smartphone & Tablet Hyperscalers, PC Automotive Consumer Electronics

Fabless IDM

Wafer Foundry IDM Fab

EMS

Packaging

and Test

OSAT

IDM Factory

Disclaimer

Amkor Technology Inc. published this content on May 02, 2025, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on May 02, 2025 at 23:04 UTC.