Amkor Technology : Investor Presentation – April 2026

Published: 2026-04-30 00:48:10 ET AMKR

Published on 04/30/2026 at 12:48 am EDT

Enabling the Future

Amkor Technology Investor

Presentation

April 2026

Global OSAT

Broad geographic footprint in 8 countries

Amkor at a Glance

Years

Largest

of experience packaging and testing

semiconductors

$6.7B 2025 Revenue

Headquartered

OSAT

U.S. based manufacturing coming soon

Global semiconductor companies rely on Amkor

2025 Advanced Packaging

83%

2025 CapEx

$905M

% of Revenue

Advanced Packaging Revenue CAGR1 9%

Investing for our future

Advanced technology supporting HPC, SiP and Test

Note: OSAT is defined as Outsourced Semiconductor Assembly and Test

1 Reflects 2020-25 Advanced Packaging revenue CAGR

Increasing Total Addressable Market

Generative AI and Connected Trends

Semiconductor Market

$1,500

$1.5 Trillion

($ in billions)

$1,000

$1 Trillion

Smartphones Data Centers

Laptop Desktop Mobile

Gaming Home Audio

$500

2002 2004 2006 2008 2010 2012 2014 2016 2018 2020 2022 2024 2030E

Source: Gartner, McKinsey

Early design engagement with OEMs and semiconductor companies enhances packaging innovation

Packaging and Test Integral to Semiconductor Supply Chain

Original Equipment

Manufacturers

Semiconductor

Companies

Wafer

Manufacturing

Final Product

Assembly

Smartphone & Tablet Hyperscalers, PC Automotive Consumer Electronics

Fabless IDM

Wafer Foundry IDM Fab

EMS

Packaging

and Test

OSAT

IDM Factory

Amkor's Turnkey Service Offering

Reduce Cycle Time, Increase Value

Design Innovation

Materials Management

Wafer Bump, Probe, Dicing

Package Assembly

Final Test Burn-in, SLT

Drop Ship

Leadframe, Power

MEMS & Sensors

Memory

Flip Chip, PoP MCM

2.5D, High-Density Fan-

SiP, Heterogeneous

WLFO

Out

Integration

Executing Our Strategy to Deliver Shareholder Value

Elevate Technology Leadership

Tier 1 OSAT with complete Advanced packaging and test portfolio

Trusted innovation partner for industry leaders

Proven operational excellence track record

Expand Geographic Footprint

Broadest OSAT geographic footprint

Expanding in U.S., Korea and Taiwan

Well positioned to enable regional supply chains

Enhance Strategic Partnerships in Key Markets

5G communications HPC and AI Automotive electronics IoT devices

Amkor is an Advanced Packaging Leader

Optimize Power, Performance and Area with

Packaging Design & Materials

Increased Silicon Complexity

Heterogeneous Integration Larger Module Size or

Miniaturization

Enhanced Material

Performance

Broad Geographic Footprint

13 Million Square Feet (1.2M sqm) of Manufacturing Space

KOREA

4.48M sf (0.42M sqm)

JAPAN

1.77M sf (0.16M sqm)

SHANGHAI

1.40M sf (0.13M sqm)

TAIWAN

1.17M sf (0.11M sqm)

PORTUGAL

0.58M sf (0.05M sqm)

UNITED STATES

COMING SOON!

VIETNAM

1.47M sf (0.14M sqm)

MALAYSIA

PHILIPPINES

1.43M sf (0.13M sqm)

0.43M sf (0.04M sqm)

Amkor Headquarters

Assembly & Test Facility Customer Support Center

Diversified End Markets

Leveraged to Industry Megatrends

2025 Results

46%

19%

15%

Communications

Smartphones l Tablets

Computing

Data Center I Infrastructure

PC/Laptops I Storage

Automotive & Industrial

ADAS I Electrification

Infotainment l Safety

Consumer

A/R & Gaming I Connected Home I Home Electronics I Wearables

Communications

Amkor Supports All Smartphone Functions

RF Front End

Sub-6 Ghz & mmWave

Sub-system Modules

Sensors

AI Apps Processor

Storage

Baseband Modem

Wireless Charging

On-device AI

Increasing performance requirements 5G and RF functionality

High Performance Computing

Amkor's Capabilities Support All Big Data Requirements

Megatrend Drivers

Artificial

Intelligence

ARM

Hyperscale

Network Switches

Cloud Computing

Heterogeneous Integration

Accelerators

Power Delivery

AI PC

AI inference and training

Custom silicon solutions, new fabless

entrants

Automotive Electrification

Amkor is a Leading Automotive OSAT

Megatrend Drivers

ADAS

SiC

Domain Controllers

V2X

In-car Networking

LIDAR

Radar

Power Modules

Autonomous functionality

Infotainment, telematics, digital cockpit

Electrification

IoT Consumer Products

Amkor is Enabling the Proliferation of IoT

Megatrend Drivers

PMIC

Apps

P or

rocess

System Modules

Health Sensor

GPS

Wireless Charging

Connectivity

Security

Ultra small form factor with multiple

functions

Hearables, wearables, fitness and health, smart homes

Connected everything

Trusted Partner to Global Semiconductor Companies

CapEx Supports Growth and Innovation

Capital Expenditures

($ in millions)

12.8%

13.5%

Expect 2026 Capital Expenditures(2)

of Around

12.7%

11.5%

11.8%

10.9%

$553

$744

$749

$780

$905

$908

Key Areas of Investment

Construction of Arizona facility Expansion in Korea

2020 2021 2022 2023 2024 2025

See corresponding endnotes on slide 25.

Advanced packaging capacity for HDFO and Test

Financial Results

($ in millions except for EPS)

Revenue

$7,092

$6,138

$6,503

$6,318

$6,708

$5,051

17.8%

$901

20.0%

Gross Profit

18.8%

$1,330

14.5% 14.8% 14.0%

$943 $933 $939

Gross Profit

Gross Margin

2020 2021 2022 2023 2024 2025

(4)

$1,226

2020 2021 2022 2023 2024 2025

Operating Income

9.1%

7.2%

6.9%

7.0%

$467

$438

$470

$457

$763

$897

12.4% 12.7%

EPS

$3.11

$2.62

$1.40

$1.46

$1.43

$1.50

2020 2021 2022 2023 2024 (4)

See corresponding endnotes on slide 25.

2025 (5)

2020 (3)

2021 2022 2023 2024 (4)

2025 (5)

Free Cash Flow and Leverage

($ in millions)

Free Cash Flow*

EBITDA and Leverage*

$194

$221

$308

$344

$359

$534

1.2x

1.1x

$960

$1,091

$1,162

$1,135

$1,331

0.9x

$1,529

0.8x

2020 2021 2022 2023 2024 2025

2020 2021 2022 2023 2024 2025 (5)

See corresponding endnotes on slide 25.

*See discussion of Non-GAAP measures on slide 24 and the reconciliation to the most directly comparable GAAP measure on slides 22-23.

Balanced and Disciplined Capital Allocation Strategy

Invest in Organic Growth

▶ Invest in manufacturing scale and in diversifying global footprint

▶ Invest in R&D to enhance technology in partnership with lead customers

Strategic Investments

▶ Support regional semiconductor supply chains

▶ Tuck-in M&A for strategic business growth

Maintain Balance Sheet Strength & Flexibility

▶ Debt to EBITDA* at or below 1.5X long term

▶ Maintain strong liquidity for maximum flexibility

Shareholder Returns

▶ Return 40%-50% of Free Cash Flow* over time1

▶ Growth in regular quarterly dividend2

▶ $300M authorized share buyback program

1 Cumulative free cash flow starting 2022; 2 Subject to Board approval

*See discussion of Non-GAAP measures on slide 24 and the reconciliation to the most directly comparable GAAP measure on slides 22-23.

Corporate Responsibility Commitment

Mission

Amkor delivers agile and dependable manufacturing and supply chain solutions developed in close collaboration with our customers

Reporting Frameworks

▶ SASB Semiconductor Standard

▶ CDP (Carbon Disclosure Project) - Earned "A" score

Governance

▶ Nominating and Governance Committee

▶ Corporate Compliance & Responsibility Committee

Industry Coalition

▶ Responsible Business Alliance

▶ Responsible Minerals Initiative

▶ Semiconductor Climate Consortium

Environmental Goals

▶ 20% reduction in water usage and waste generation by 2030

Climate Change - Net Zero Emissions by 2050

▶ The SBTi has verified Amkor's net-zero science-based target by 2050

▶ Near-term target: 55% absolute reduction in Scope 1 and 2

GHG emissions by 2033

Disclaimer

Amkor Technology Inc. published this content on April 30, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on April 30, 2026 at 04:47 UTC.