Nova : May 2026

Published: 2026-05-14 09:50:21 ET NVMI

Published on 05/14/2026 at 09:50 am EDT

May 2026

Metrology and Process Control Unique Solutions for Semiconductor Manufacturing

Nova Ltd. Nasdaq (NVMI) Novami.com

Outperforming WFE by

Resilient business model

Differentiated Portfolio

Diverse Revenue Streams

Global Footprint

$881M

+31% YoY

2025 Revenue

$1.6B

Cash Reserves

as of Dec. 31, 2025

>7300

Active Systems

$8.62

+29% YoY

2025 EPS

$218M

Free Cash Flow

>400

Customer Sites

Nova Products vs. WFE,

2020-2025 CAGR

WFE Nova

Source: Company Non-GAAP Financials data.

All Data as reported for fiscal year 2025, EPS per diluted share

Source: 5Y CAGR 2020-2025, Nova product revenue WFE: Gartner, 2025

Revenue

+10%

YoY

EPS

+7%

YoY

$213M

$2.18

$235M

$2.33

Highlights

Record revenues from memory devices, driven by demand for advanced DRAM and HBM

Record sales of Nova Metrion, driven by advanced nodes in both memory and logic

Q1 2025 Q1 2026

Company Guidance Revenue EPS

$2.10- $2.24 (GAAP)

Q2 2026 $245 -$255M

$2.34-$2.48 (non-GAAP)

Record sales of Nova AncoScene front-end chemical metrology solution, driven by market share growth and new customer penetrations

Non-GAAP Financials, Q1 2026

A Market Leap

Nova Benefits from AI Demand in Multiple Segments

13%

>$1T

Semiconductor Industry Revenue, B$

End Markets

30%

Market Segments

Advanced

CAGR

471

831

1548

Data Center & Networking

10%

Consumer

11%

Industrial

Logic GAA

HBM

Silicon Photonics

DRAM

52%

50%

35%

21%

2023

Automotive

13%

Advanced Packaging

2.5D/3D

18%

2020

2025

2030

2025-2030 CAGR

2024-2029 CAGR*

Source: Gartner, Tech Insights, averaged forecast May 2026, 10Y CAGR 2020-2025

Sources: Gartner, Tech Insights, Yole Research, IDC, McKinsey 2025; Si Photonics CAGR 2024-2030

Manufacturing Challenges Rise in Every Segment

Memory

3D NAND

Bonding interface

DRAM

AI Processor

HBM

Silicon Photonics

Increasing Complexity

2020 vs. 2025

Advanced Logic (AI-Enabled)

Wordline steps

Storage

Local Memory

AI Data center

Logic (GPU/CPU)

FinFET

CPU

227B

Advanced Packaging

Transistors

HBM

Advanced packaging

CoWoS (2.5D)

3D-SOC

<10µm

NAND

43XL

X30

I/O Pitch

Layers

16L

DRAM

16GB

X2.5

Stacked chips

Memory Cells

Source: Gartner, Tech Insights, Yole, public manufacturer reports 2020-2025

Market Demand Drives Multiple Technology Inflection Points

AI needs Better Performance

Power Efficiency

Density

Logic

GAA + BPD CFET

DRAM

4F2 DRAM 3D DRAM

3D NAND

Growing Complexity

Complex, scaled 3D structures

Packaging complexity

New materials and chemistries

New connectivity: Silicon Photonics

Higher Process Control

Cost

Multi Stack

Advanced Packaging

Controller Processor

Multi Deck (HB)

Intensity

More process steps

Tighter process windows

Wafer edge criticality

2.5D Interposer

Silicon Interposer

Nova Process Insight: Revealing the Invisible

Measure with precision, manufacture with confidence

Optical X-Ray Chemical Analysis

Dimensional

Materials

Chemical

300, 200, 150 mm

Wafers

AI-Powered Software Suite

Physical modeling &

Algorithms

Logic

FinFET GAA BPSD

Packaging & Other

2.5D Interposer 3D

HBM

Silicon Photonics

Memory

3D NAND

Advanced DRAM 3D DRAM

Metrology Portfolio Targeted at Key Challenges

Logic

Memory

Packaging

Dimensional

Materials

Chemical

Nanosheets individual thickness

HAR TSVs

MOL structure complexity

Wafer edge metrology

Si, SiGe stress and strain

Multi-work function layers

New material characterization

Increasing vias volume & aspect ratio

More plating steps, tighter process control

HAR profiles & CD's

Hybrid bonding, Cu recess control

Warpage

3D DRAM profiling

Si, SiGe stress and strain

Composition & thickness

Doping & contamination

Increasing vias volume & aspect ratio

Tighter contamination control

TSV & RDL

Panel-level & frame handling

Warpage & thinner dies

Topography

Pre & Post- hybrid bonding

uBump metal oxidation control

Hybrid bonding surface characterization

More Plating steps

Bonding & connection materials

proprietary information

Contaminants & photoresist leach detection

Measuring Critical Applications Across the Industry

Dimensional Optical CD

Materials

Chemical

Integrated

VeloCD/ Standalone

Prism

WMC

VeraFlex® (XPS+SRF)

Elipson® (Inline Raman)

Metrion® (Inline SIMS)

AncoScene® Front-End

Ancolyzer® Wafer level packaging

DMR®

Direct Metal Replenishment

Adv. Logic

Adv. Memory

Adv. Packaging

Specialty Devices

150. 200, 300mm wafers

Already measuring related applications in fabs

Advanced packaging includes hybrid bonding and HBM processes; Specialty Devices - sensors, power, analog

Intelligent software layer, delivering continuous insights and optimization, increasing Nova systems asset value

Productivity

Predictive and Preventive Maintenance, trouble shooting and utilization improvements

Manage large fleets, boosting efficiency, and high scale metrology control

Modeling

Physics, AI & advanced algorithms applied to model the most advanced structures

Machine learning leveraged to reduce time to solution and increase throughput

proprietary information

Product strategy

Organic &

Maintain Tech Leadership

of Annual Revenue invested in R&D

Materials

Leadership

New Growth Engines

Early Access

Lab to Fab Technology

Path Finding and Incubation

Adjacent

Process Control Markets

Company non-GAAP financial data, gross investment

Operating Margin Earnings

28%-33% ~10$

$1000M

M&A

Revenue

+$1B

Gross Margin

57%-60%

R&D Investment

15%-17%

SG&A

12%-14%

Tax

15%

Share Count

32M

$800M

$600M

$400M

2019 2024 Target

Non-GAAP Financials

Global Strength, Ready for Secular Growth

4 R&D and Production Centers, 31 sites

Europe

USA Germany

Korea

California 8 sites

5 Sites

China

4 Sites

Japan

2 Sites

Israel

2 Sites

Taiwan

Legend:

R&D and Production Field site: Sales & Service

Rehovot

Corporate sites

Singapore

1 Site

5 Sites

Source: Company data,: office, lab, warehouse and cleanroom

To become an active influencer in creating a more sustainable and equitable future

Integrity &

Transparency

Governance

People First Always

Social

Scope 1+2 Foundation

Established

Environment

proprietary information

Read the 2025 Sustainability Impact Review

End market demand and process complexity drive growth

Increasing need for advanced metrology and process control solutions

proprietary information

Positioned for Continuous Growth

Unique, disruptive technology portfolio

Strong market position across key segments, Broad portfolio addressing critical applications, Significant investment in R&D

Solid operational model

Supports clear strategy for long-term growth

[email protected]

Disclaimer

Nova Ltd. published this content on May 14, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on May 14, 2026 at 13:47 UTC.