Lightwave Logic : Presentation > (Lightwave Logic Q1 2026 Financial Results and Business Update)
LWLG
Published on 05/13/2026 at 08:13 pm EDT
Q1 2026 Financial Results & Business Update
NASDAQ:LWLG May 13, 2026
CONNECTIVITY
BANDWIDTH
POWER
INTEGRATION
AI Data Center (non-AI)
Telecom/Scale Across
Future Opportunities
$37 billion TAM
$10 billion TAM
$7 billion TAM
45M units of 1.cTb/s and 3.2Tb/s
transceivers/CPO (200Gb/s+ lane)
= 230M modulators
1cM units of high-speed
transceivers (200Gb/s+ per lane)
= 128M modulators
3.5M units of coherent/DWDM transceivers (>800Gb/s per transceiver*)
= 5M modulators
Ǫuantum Computing Aerospace & Defense Consumer Electronics
$2 - $4 billion SAM (2028)
Serviceable optical transceiver market for EOP /SOH modulators depending on integration level
Source: Lightcounting 2028 forecast for Ethernet transceivers; April 2026
*Due to complex encoding schemes Gb/s/lane not applicable 4
Duration
Technology Selection
Product Design
Prototype to Final Product
Production Ramp to
High Volume
Total: 18 - 24 months
12 - 18 months
3 - 6 months
3 - 6 months
Engagements
~20 in Early Stages of Pipeline
4 in Prototype Stage
Targeting 2H 2027
Polariton
Fortune Global 500
Fortune Global 500 (CPO)*
Fortune Global 500
Expect 1-2 additional customers in Prototype Stage 3 by the end of Q3 2026
*Formal product launch decision is contingent upon the successful execution of technical milestones related to Perkinamine® performance as well as achieving various other modulator design and integration results
5
Total Optical Transceiver Market1
(by technology)
$39.7B
$11.2B
$2.6B
23%
Optical transceiver market expected to grow
to $70 billion by 2030 (22% CAGR '25-'30)
SiPho expected to be dominant technology
with >70% market share (39% CAGR '25-'30)
$20.2B
51%
$49.7B
71%
Total Sales
$70.4B
2021 2026e 2030e
Silicon photonics is winning the integration platform battle for hyperscale and AI networking
1 Lightcounting: Total Optical Transceiver Market by Technology; April 2026
News sources: CNBC, Data Center Dynamics, Credo, GlobalFoundries, PIC Magazine, Reuters 6
Foundry PDfi Integration
Additional Projects
+ One unnamed partner
Foundries are key enablers to integration and scaled production as well as IP licensing strategy
Polymer platform integrated in foundry ecosystem; processes and designs are ready for 400Gb/s device deployments Multiple tape outs planned throughout 2026
7
Material Reliability Challenges Addressed
Device Reliability In Progress
Temperature = 85 °C Humidity =85%rh
Data demonstrates LWLG EO polymer is
very stable at high temperatures (>>100yr projected lifetime at 85°C)
Data showed no decomposition in harsh
environments (e.g., 85°C/85% r.h.)
N/A for applications in which EO
polymers is not exposed to 3.8eV photons (326nm or lower)
Data showed this failure mode is not
likely with proprietary encapsulation
Loss of Poling
Chromophore
Decomposition
Photolysis
Photo-Oxidation
2025 Milestone: Validated that latest generation LWLG EO polymers pass Telcordia stress tests when used with proprietary encapsulation
Ongoing chip and device level reliability tests to validate reliability for foundry specific processes and device level encapsulation
8
Materials
Optical Devices
Patent protection on new, innovative EO chromophores and molecular architectures to meet application needs such as high electro-optic activity and stability
Patent portfolio spans major aspects
of manufacturing and operations
67 granted; 80+ pending
U.S. and international patents as of
December 31, 2025
Patented device designs to engineered approaches to enhance performance and optimize controls within modulators
Fabrication
Protected fabrication and manufacturing methods to enhance ways for partners to work with materials and advance ease of use
Integration
Packaging
Patented integration methodologies to add functionality to existing semiconductor devices and innovate photon exchange with minimal losses
IP protection is essential to monetization and royalty licensing strategy
Important patent protection on encapsulation and packaging to address key challenge of maintaining the quality of RF electrical signals and hermetic sealing
9
N E T L O S S P E R S H A R E
( $ )
Flat
vs. a loss of $0.04 prior year
N E T L O S S
( $ m i l l i o n s)
+34% YoY
vs. a loss of $4.7M prior year
T O T A L R E V E N U E
( $ t h o u sa n d s)
+27% YoY
vs. $23K prior year
2026
F I N A N C I A L
R E S U L T S
C A S H & E Q U I V A LE N T S
( $ m i l l i o n s)
+200% YoY
vs. $25.0 prior year
G & A E X P E N SE
( $ m i l l i o n s)
+78% YoY
vs. $1.8M prior year
R & D I N V E S T M E N T
( $ m i l l i o n s)
+13% YoY
vs. $3.1M prior year
Added a Fortune Global 500 company to Prototype Stage 3 of Design Win Cycle in February
Signed a development agreement ith To er Semiconductor to use our polymer technology on To er's PH18 silicon photonics platform
Announced availability of polymer technology ithin GDSFactory PDK to support
GlobalFoundries' silicon photonics platform
Announced availability of polymer technology
ithin Luceda PDK targeting SilTerra's silicon
photonics platform
10
1
Advance Stage 3 programs toward qualification milestones and Stage 4
2
Convert technical engagements into structured commercial agreements
3
Broaden and strengthen the EO polymer-ready silicon foundry ecosystem
4
Continue performance optimization at 200G, 400G per lane and beyond
5
Prepare operationally for a 2027 production ramp transition
11
Contact IR:
Ryan Coleman or Nick Teves
+1 (312) 445-2870
Disclaimer
Lightwave Logic Inc. published this content on May 14, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on May 14, 2026 at 00:12 UTC.