ASYS
Published on 05/13/2026 at 04:09 pm EDT
COMPANY INTRODUCTION NASDAQ: ASYS
M a y 2 0 2 6
Enabling AI Semiconductor Device Packaging and Advanced Substrate Fabrication
Business Transformation to Deliver Profitable Growth
Safe Harbor Statement
This Presentation may contain certain statements or information that constitute "forward-looking statements" (as such term is defined in Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, and the Private Securities Litigation Reform Act of 1995). In some, but not all, cases, forward-looking statements can be identified by terminology such as "may," "plan," "anticipate," "seek," "will," "expect," "intend," "estimate," "anticipate," "believe," "continue," "predict," "potential," "project," "should," "would," "could", "likely," "future," "target," "forecast," "goal," "observe," and "strategy" or the negative of these terms or other comparable terminology. Examples of forward-looking statements include statements regarding Amtech System, Inc.'s ("Amtech" or the "Company") future financial results, operating results, business strategies, projected costs, products under development, competitive positions, plans and objectives of Amtech and its management for future operations, efforts to improve operational efficiencies and effectiveness and profitably grow our revenue, and enhancements to our technologies and expansion of our product portfolio. Such forward-looking statements and information are provided by the Company based on current expectations of the Company and reflect various assumptions of management concerning the future performance of the Company, and are subject to significant business, economic and competitive risks, uncertainties and contingencies, many of which are beyond the control of the Company. Accordingly, there can be no guarantee that such forward-looking statements or information will be realized. Actual results may differ materially from historical results and expectations based on forward-looking statements made in this document or elsewhere by Amtech or on its behalf. No representations or warranties are made as to the accuracy or reasonableness of any expectations or assumptions or the forward-looking statements or information based thereon. Each recipient of forward-looking statements should make an independent assessment of the merits of and should consult its own professional advisors. Except as required by law, we undertake no obligation to publicly update forward-looking statements, whether as a result of new information, future events, or otherwise. These forward-looking statements speak only as of the date of this Presentation. Except as required by any applicable law or regulation, the Company expressly disclaims any obligation or undertaking to release publicly any updates or revisions to any forward-looking statements contained herein to reflect any change in the Company's expectations with regard thereto or any change in events, conditions or circumstances on which any such statement is based.
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Capital equipment and consumables for semiconductor fabrication and packaging
Thermal Processing Solutions (~70%)
Semiconductor Fabrication Solutions (~30%)
Reflow Oven Belt Furnace
Advanced packaging & electronics assembly equipment for applications such as AI GPUs, and advanced automotive electronics.
Lapping, Polishing,
Consumables and equipment utilized in Silicon and Silicon Carbide semiconductor fabs for advanced automotive applications such as EV/HEV and industrial electronics.
& Cleaning Consumables
CMP Parts & Upgrades
Enabling production of AI enterprise servers and e-mobility systems
Approximate Revenue Contribution LTM, May 2026
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12 Optimization efforts delivered annualized savings of $13M, breakeven reduced from about $120M to about $75M 10
8
6
4
2
24
0
Q2'
-2
Q3'24 Q4'24 Q1'25 Q2'25 Q3'25 Q4'25 Q1'26 Q2'26
-4
Adj. EBITDA (TTM) Cash Provided by Operations (TTM)
Rationalized product-lines
Migrated to semi-fabless model
Right-sized organization
Upgraded supply chain processes
Improvements in value-based pricing
Eliminated debt and built cash balance
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Flip chip packaging
2.5D packaging CoWoS packaging Panel packaging Optical packaging Server board SMT
High Performance Reflow for Die-Level Packaging ("on Substrate")
Advanced Chip Packaging & Assembly
More than 3X Growth in AI Revenue Annually
34% of Segment 1H26 Revenue, up from 6% for 1H25
TrueFlat Thin Substrate Reflow Ovens Precision Convection Reflow Ovens
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CMP Foundry serves as a process development center for early-stage semiconductor and photonics companies.
Enables rapid development and validation of CMP processes for advanced materials including Si, SiC, III-V, and photonic substrates.
Specializes in planarity, uniformity, surface roughness, and CMP of patterned wafers.
Supports process refinement and consumable screening to accelerate technology adoption and reduce development costs.
Facilitates integration of Intersurface Dynamics' customized chemistries as process of record (POR) for cleaning and polishing.
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Name of Presentation
I N V E S T M E N T O P P O R T U N I T Y
Supplying Essential Semiconductor Equipment and Materials
Committed to a disciplined approach to operations and scaled fixed costs
Funds from operations strategically invested in growth
Market-leading products enabling scale in AI & e-mobility applications
AI Product Demand Continues to be Strong
Quarterly Orders Exceed Revenues
Gross Margin Improved to 48%, up 300 bps from 1Q26
10th Consecutive Quarter of Positive Operating Cash Flow
$5 Million Share Repurchase Plan in Place
Net revenue of $20.5 million
Cash of $24.4 million
Cash provided by operations of $2.1 million
GAAP net income of $1.2 million
Non-GAAP net income of $1.5 million (1)
Adjusted EBITDA of $2.5 million (1)
Customer orders of $21.1 million
Backlog of $22.3 million
(1) See GAAP to non-GAAP and EBITDA and Adjusted EBITDA reconciliation provided below
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OUTLOOK
(period end 6/30/26)
Revenues $20.5 - 22.5 Million
Adjusted EBITDA margin in low double digits range
NOL valued at $74.3 million at 9/30/25
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AMTECH SYSTEMS, INC. (NASDAQ: ASYS)
(Unaudited)
Reconciliation of GAAP to Non-GAAP Financial Measures (in thousands, except per share data)
Amtech Systems, Inc. Gross Profit (Loss):
March 31,
2026
Three Months Ended December 31,
2025
March 31,
2025
Six Months Ended March 31,
2026 2025
GAAP gross profit (loss)
Inventory write-down of mature node semiconductor products
Non-GAAP gross profit
$ 9,769 $
-
$ 9,769 $
8,493
-8,493
$ (325 )
5,986
$ 5,661
$ 18,263
-
$ 18,263
$ 9,038
5,986
$ 15,024
GAAP gross margin
Non-GAAP gross margin
48 %
48 %
45 %
45 %
(2 )%
36 %
46 %
46 %
23 %
38 %
Thermal Processing Solutions Segment Gross Profit:
GAAP gross profit
Inventory write-down of mature node
$ 7,129
$ 6,592 $ 350
$ 13,722
$ 7,680
semiconductor products Non-GAAP gross profit
-
$ 7,129
-
$ 6,592
3,562
$ 3,912
-
$ 13,722
3,562
$ 11,242
GAAP gross margin
48 %
47 % 3 %
48 %
26 %
Non-GAAP gross margin
48 %
47 %
37 %
48 %
38 %
Semiconductor Fabrication Solutions Segment Gross Profit (Loss):
GAAP gross profit (loss)
Inventory write-down of mature node semiconductor products
Non-GAAP gross profit
$ 2,640
-
$ 2,640
$ 1,901
-
$ 1,901
$ (675 )
2,424
$ 1,749
$ 4,541
-
$ 4,541
$ 1,358
2,424
$ 3,782
GAAP gross margin
Non-GAAP gross margin
46 %
46 %
38 %
38 %
(13 )%
35 %
42 %
42 %
13 %
35 %
AMTECH SYSTEMS, INC. (NASDAQ: ASYS)
(Unaudited)
Reconciliation of GAAP to Non-GAAP Financial Measures (in thousands, except per share data)
March 31,
Three Months Ended December
March 31,
Six Months Ended March 31,
Consolidated Net Income (Loss):
GAAP net income (loss)
Inventory write-down of mature node semiconductor products
Amortization of acquired intangible assets Stock compensation expense
Goodwill impairment Intangible asset impairment Severance expense
2026
$ 1,166
-27
328
-
-
-
31, 2025
$ 108
-27
249
-
-
-
2025
$ (31,812 )
5,986
107
290
20,353
2,569
184
2026
$
1,274
-54
577
-
-
-
2025
$ (31,500)
5,986
215
623
20,353
2,569
256
Non-GAAP net income (loss)
$ 1,521
$ 384
$ (2,323 )
$ 1,905
$ (1,498)
Net Income (Loss) per Diluted Share: GAAP net income (loss) per diluted share Inventory write-down of mature node semiconductor products
Amortization of acquired intangible assets Stock compensation expense
Goodwill impairment Intangible asset impairment Severance expense
$ 0.08
-
-0.02
-
-
-
$ 0.01
-
-0.02
-
-
-
$ (2.23 ) $ 0.42
0.01
0.02
1.43
0.18
0.01
0.09
-
-0.04
-
-
-
$ (2.21)
0.42
0.02
0.04
1.43
0.18
0.02
Non-GAAP net income (loss) per diluted share
$ 0.10
$ 0.03
$ (0.16 )
$ 0.13
$ (0.10)
AMTECH SYSTEMS, INC. (NASDAQ: ASYS)
(Unaudited)
Reconciliation of Net Income to EBITDA and Adjusted EBITDA (in thousands, except per share data)
Amtech Systems, Inc. EBITDA:
Three Months Ended March
31, 2026
Six Months Ended March 31,
2026
GAAP net income $
1,166
$ 1,274
Interest income
(116 )
(231 )
Interest expense
8
15
Income tax provision
502
1,083
Depreciation and amortization expense
627
1,241
EBITDA
2,187
3,382
Stock compensation expense
328
577
Adjusted EBITDA $
2,515
$ 3,959
Disclaimer
Amtech Systems Inc. published this content on May 13, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on May 13, 2026 at 20:08 UTC.